Staff Process Engineer
Core
Design and qualify PQFN packages for Smart Power Stage (SPS) products, manage assembly processes for thin die and Cu Clip, and sustain manufacturing operations.
Role type
Staff Process Engineer (Semiconductor Packaging & Assembly)
Builds
PQFN packages, SPS modules, and associated assembly processes for automotive, industrial, and IoT applications.
Domain
Semiconductor manufacturing, specifically power semiconductor packaging and thin-wafer handling.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
process engineering, package development, thin wafer handling, SPS solder attach, quality/reliability standards, wire bonding, statistical process control (SPC), JMP, change management, supplier management, NPI-to-production transfer.
Preferred skills
Cu Clip expertise, thin die assembly, package development, NPI to mass production transition.
Technologies
JMP, SPC software, SPS solder attach processes, wire bonding equipment.
Responsibilities
Design and qualify PQFN packages for SPS products; ramp up manufacturing volume and qualify sources; improve assembly yield, capacity, quality, and costs; address customer feedback with cross-functional teams; manage Product Lifecycle Management documents; conduct change management with suppliers; partner with Quality and Reliability teams; serve as manufacturing engineering interface for NPI-to-production transfers; manage OSAT and contract manufacturing relationships.
Seniority
Staff, hands-on IC with strategic oversight.
