Process Engineer
Core
Develop, optimize, and sustain die bond and wire bond processes to ensure stable and high-quality manufacturing performance in semiconductor back-end assembly.
Role type
Process Engineer (semiconductor back-end assembly)
Builds
Semiconductor packages (die bonding, wire bonding)
Domain
Semiconductor manufacturing / Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
die bonding, wire bonding, process troubleshooting, root cause analysis, statistical process control (SPC), design of experiments (DOE), new product introduction (NPI), process qualification, data analysis
Preferred skills
QFN package experience, yield improvement, reliability testing, failure analysis, automation setup
Technologies
back-end equipment, leadframes, substrates, adhesives, bonding wires
Responsibilities
Develop and optimize die bond and wire bond processes; Perform troubleshooting and root cause analysis for yield loss and defects; Support NPI and process qualification; Establish process parameters and control plans; Analyze process data using statistical methods; Drive continuous improvement for cost, yield, and cycle time
Seniority
Mid-level, hands-on IC
