Assembly Process Engineer
Core
Develops, monitors, and optimizes post-wafer manufacturing operations including wafer dicing, chip packaging, wire bonding, and final testing to ensure high reliability and low cost.
Role type
Assembly Process Engineer
Builds
Semiconductor packaging and assembly processes
Domain
Semiconductor manufacturing (backend)
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), failure analysis, SOP creation, material testing, cross-functional collaboration
Preferred skills
Leading teams, planning and execution, analytical decision-making
Technologies
SPC tools, failure analysis tools, packaging equipment (sawing, flip-chip, wirebond, molding, BGA)
Responsibilities
Fine-tune back-end operations like sawing, flip-chip bonding, die bond, wirebond, molding, and BGA packaging; Track defect rates using SPC and failure analysis tools to fix line issues; Run Design of Experiments to test new materials, tooling changes, or recipe updates; Write clear standard operating procedures (SOPs) and material specifications
Seniority
Mid-level (3+ years experience)