Process Engineer (WB)
Core
Develop, optimize, and sustain Die Attach and Wire Bond processes to ensure stable manufacturing, high yield, and cost effectiveness in semiconductor production.
Role type
Process Engineer (Semiconductor Manufacturing)
Builds
Die Attach and Wire Bond processes for semiconductor chips
Domain
Semiconductor manufacturing / Process Engineering
Required skills
DOE, FMEA, SPC, DMAIC, 8D, root cause analysis, process optimization, equipment parameter tuning, yield improvement, defect reduction, cost reduction, new product introduction support, quality compliance
Preferred skills
Mechanical, Electrical, Electronics, Material Science, or Material Engineering background
Technologies
MS Excel, PowerPoint, Office tools
Responsibilities
Develop and optimize Die Attach and Wire Bond processes; Monitor production performance, stability, and defect trends; Lead yield improvement and defect reduction initiatives using 8D, DMAIC, and Pareto analysis; Optimize machine parameters and collaborate with Equipment Engineering; Support new product introduction and process qualification; Lead technical investigations for customer complaints; Drive material cost reduction and productivity improvements.
Seniority
Mid-level, hands-on IC