ENGR I, PROCESS; MFG
Core
Develop, maintain, optimize, and troubleshoot die attach manufacturing processes to ensure product quality, yield improvement, and production efficiency.
Role type
Process Engineer (Semiconductor Assembly)
Builds
Semiconductor components via die attach processes
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE, root cause analysis, SPC, data analysis, process documentation, material evaluation, equipment evaluation
Preferred skills
Semiconductor assembly knowledge, Minitab/JMP proficiency
Technologies
Minitab, JMP
Responsibilities
Monitor and optimize die attach process performance; Troubleshoot process issues and drive root cause analysis; Support new product introduction (NPI), qualification, and process transfer activities; Conduct DOE, yield improvement, and defect reduction projects; Develop and maintain process documentation, specifications, and control plans; Support material and equipment evaluations
Seniority
Junior, entry-level IC