Staff Package Design Engineer- experienced in package development of power SiP/module
Core
Design and develop package and interconnect methods for power SiP/modules, wafer level, flip-chip, and multi-chip module applications.
Role type
Staff Package Design Engineer (Power SiP/Module)
Builds
Power SiP modules, wafer level packages, flip-chip assemblies, and multi-chip modules for consumer, industrial, and automotive markets.
Domain
Semiconductor packaging and power electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer processing (front/back metal, backgrinding, glass carrier bonding), Package qualification, OSAT/CM management, DOE execution, Process integration, Production controls, Statistical analysis (SPC), Package design rules
Preferred skills
Wire-bonding, Multi-chip module technologies, Embedded die in substrate
Technologies
SPC software, DOE tools
Responsibilities
Design and develop package/interconnect methods for power SiP/modules; Benchmark and qualify materials, processes, and subcontractors; Optimize processes via DOE with OSAT/CM; Resolve process integration issues; Establish production controls and ramp-up monitors; Address customer complaints with cross-functional teams; Participate in packaging roadmap development; Maintain technical expertise on packaging innovations.
Seniority
Senior, hands-on IC
