Senior Staff Package Design Engineer
Core
Design and develop package and interconnect methods for power SiP/modules, flip-chip LGA, and multi-chip modules with substrate or embedded die/capacitor.
Role type
Senior Staff Package Design Engineer
Builds
Power SiP/modules, flip-chip LGA, multi-chip modules with substrate or embedded die/capacitor
Domain
Semiconductor packaging, power electronics, automotive, industrial
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
package development, power SiP/module design, wafer level packaging, flip-chip LGA packaging, assembly process knowledge, qualification methods, SPC, statistical analysis software
Preferred skills
Cu FSM/BGBM technologies knowledge
Technologies
DOE, SPC, statistical analysis software
Responsibilities
Design and develop package and interconnect methods, qualify package technologies for consumer/industrial/automotive applications, benchmark and select materials/processes/subcontractors, work with OSAT/CM to optimize processes and establish specs, resolve process integration issues, establish production controls, ensure smooth transition into production, address customer complaints, develop and maintain package design rules
Seniority
Senior Staff, hands-on IC
