Director, Package Design Engineering
Core
Lead package technology development, NPI, and global OSAT management for AI/Datacenter power packaging solutions.
Role type
Director, Package Design Engineering
Builds
Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages using WBG (SiC & GaN) and advanced interconnects.
Domain
Semiconductor manufacturing, Power Electronics, Wafer Level Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Power SiP/module design, Wafer level packaging, Flip-chip interconnects, OSAT/CM management, DOE optimization, Process qualification, SPC, Statistical analysis
Preferred skills
Wire-bonding, Multi-chip module technologies, DBC/AMB substrates knowledge
Technologies
SiC, GaN, DBC, AMB, Flip-chip, Multi-chip module
Responsibilities
Define technology roadmap and manage R&D budget; Benchmark and qualify materials, processes, and subcontractors; Optimize assembly processes via DOE; Resolve process integration issues; Establish production controls and quality monitors; Manage transition to production and ramp-up; Address customer complaints with cross-functional teams; Maintain package design rules.
Seniority
Director, Strategy & Execution
