Copy of Director, Package Design Engineering
Core
Lead package technology development, NPI, and global OSAT management for Renesas's AI/Datacenter Infrastructure Power packaging needs, specifically Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages including WBG (SiC & GaN) technologies.
Role type
Director, Package Design Engineering
Builds
Power SiP/modules, wafer level packaging, flip-chip interconnects, and advanced interconnect technologies for AI/Datacenter infrastructure
Domain
Semiconductor manufacturing, Power electronics, Materials science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Package development (power SiP/module, wafer level, flip-chip), OSAT/CM management, DOE process optimization, SPC and statistical analysis, process integration, production ramp-up monitoring, technical roadmap execution
Preferred skills
Wire-bonding, multi-chip module technologies, knowledge of DBC/AMB substrates
Technologies
SiC, GaN, DBC, AMB, flip-chip, multi-chip module
Responsibilities
Define technology roadmap and manage R&D budget; benchmark and qualify materials, processes, and subcontractors; optimize processes via DOE with OSAT/CM; qualify new packages with Product and Reliability teams; resolve process integration issues; establish production controls and quality monitors; ensure smooth production transition and ramp-up; address customer complaints with cross-functional teams; maintain package design rules
Seniority
Director, strategy & hands-on IC