Sr. Staff Packaging Engineer
Core
Design and develop advanced semiconductor packaging solutions for AI, HPC, and power delivery markets, focusing on high-density, high-reliability, and high-thermal-dissipation technologies.
Role type
Sr. Staff IC Packaging Engineer (Semiconductor)
Builds
Power SiP/modules, flip-chip LGA, multi-chip module, and power device packages for AI/HPC/Server/GPU markets
Domain
Semiconductor manufacturing / Advanced Packaging / Power Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor package assembly processes, leadframe design, laminate technology, power SiP/module development, flip-chip packaging, wafer front-side/back-side metallization, wire-bonding, multi-chip module design, Statistical Process Control (SPC), statistical analysis, DOE design, process qualification, production integration, AutoCAD
Preferred skills
Experience with OSAT/CM collaboration, customer complaint resolution, cross-functional team leadership, technical presentation
Technologies
AutoCAD, Excel, PowerPoint, Word, SPC tools
Responsibilities
Design and develop package and interconnect methods for Power SiP/modules, flip-chip LGA, and multi-chip module; Work with OSAT/CM to develop and run DOEs to optimize processes; Qualify new packages and processes with Product Groups and Reliability teams; Resolve process integration issues to ensure smooth production transition; Maintain technical expertise on advances in leadframe, power SiP, and flip chip interconnects; Address internal and external customer complaints with cross-functional teams