【Takasaki/Toyosu】Principle Package Engineer
Core
Develop and qualify thermal and mechanical packages for new Power MOSFET products, supporting NPI and customer design.
Role type
Senior IC package engineer (thermal & mechanical)
Builds
Power MOSFET packages (TOLL, BSC, DSC, TSC, lead frame, clip-bond) for automotive, industrial, and IoT markets
Domain
Semiconductor power electronics / Thermal engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thermal characterization and analysis, Semiconductor package design fundamentals, Reliability testing and qualification, Failure analysis techniques, Statistical data analysis, PCB and thermal design knowledge
Preferred skills
ANSYS Icepak, ANSYS Mechanical, FloTHERM, Automotive semiconductor requirements, AEC-Q101, APQP/PPAP
Technologies
ANSYS Icepak, ANSYS Mechanical, FloTHERM
Responsibilities
Define package requirements and specifications for new product development, Perform thermal analysis and package characterization, Benchmark competitor power package technologies, Develop and maintain thermal simulation models, Support customer inquiries regarding thermal performance and package selection, Coordinate package activities with Design, Product, Reliability, Manufacturing, and Marketing teams
Seniority
Senior, hands-on IC
