Senior Staff Engineer Package Technology Development
Core
Drive technology integration for semiconductor packaging, focusing on process interaction, risk assessment, and new chip technology integration.
Role type
Senior Staff Engineer, Semiconductor Packaging Technology
Builds
Semiconductor package platforms and integration of new chip technologies
Domain
Semiconductor / Power Systems / IoT
Required skills
FE/BE interaction, BE/BE interaction, 8D problem solving, DFMEA/PFMEA, internal package analysis, assembly process knowledge, surface properties, DOE & Comparative method
Preferred skills
Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or Physics degree
Technologies
None explicitly stated
Responsibilities
Drive Technology Integration activities to ensure process interaction compliance, Perform PBC and TPC assessments and drive Package Technology DFMEA, Own Risk Interaction assessment and mitigation work packages, Drive pre-development for new chip technology, Integrate unit processes (BOM and Process) and new chip technology into the package platform, Provide technical guidance and assistance to projects, Drive 8D/problem solving for interaction issues, Work closely with FE on FE/BE interaction and integration topics, Assess the impact of design rules on inter-process interaction