Senior Staff Engineer Unit Process Engineering-WB_5536
Core
Develop new wire bonding processes for semiconductor packages and establish controls to ensure high-quality, reproducible manufacturing.
Role type
Senior Staff Engineer, Unit Process Engineering (Wire Bonding)
Builds
Semiconductor packages and prototypes
Domain
Semiconductor manufacturing / Packaging
Required skills
Wire bonding process development, Parameter scouting and optimization, Statistical analysis (SPC, DOE), Root cause analysis (8D, FMEA), Equipment qualification, Technical documentation, Cross-functional problem solving
Preferred skills
Knowledge of Cu wire and ultra-fine pitch technologies, IP generation, Supplier liaison
Technologies
ASM, K&S, SHINKAWA, Minitab, Oscilloscope, Bond tester, Wire pull/shear tester, Optical microscope
Responsibilities
Identify and develop new wire bonding processes, Perform and guide WB process development (parameter scouting, optimization, verification), Support prototype builds and conduct knowledge transfer, Generate and update process documents (PFMEA, Control Plan, etc.), Lead cross-functional teams to resolve yield and quality issues, Develop new WB technologies, Provide technical guidance to junior engineers, Liaise with suppliers for equipment and material qualification
Seniority
Senior Staff, hands-on IC