Staff Equipment Development Engineer, Advanced Packaging
Core
Develop and optimize next-generation, first-of-a-kind wafer and die equipment for advanced packaging, taking ideas from conception through implementation in manufacturing facilities.
Role type
Staff Equipment Development Engineer (Advanced Packaging)
Builds
Next-generation semiconductor packaging equipment and processes
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Semiconductor process/equipment engineering, Failure analysis (FMEA, 8D, FDC), Design of Experiment (DOE), Statistical Process Control (SPC), Root cause analysis, Wafer/assembly tool operation, AI tool application
Preferred skills
Robotics knowledge, Machine logic language, Wafer/die bonding, Plating, Warpage control
Technologies
Wafer tools, Assembly tools, Overlay systems, AI tools
Responsibilities
Develop strategies to improve equipment maturity for FOAK hardware, Develop 5+ year hardware roadmaps for post probe wafer and die processing, Optimize equipment to reduce cost and increase availability, Collaborate with process development teams on innovative solutions, Conduct root cause and failure mode analysis, Perform fundamental research for next-generation equipment, Support equipment transfer to production facilities
Seniority
Staff, hands-on IC with strategic roadmap influence