SMTS Process Engineer RDA /Metrology
Core
Lead the development and scale-up of chip-to-wafer and hybrid bonding processes for high-performance 3D memory products like HBM and 3DS DRAM.
Role type
Senior Process Engineering Technical Leader (Advanced Packaging)
Builds
High-volume manufacturing processes for 3D memory
Domain
Semiconductor / Advanced Packaging
Required skills
Chip-to-wafer bonding, Hybrid bonding, Process flow development, Materials integration, Wafer fab process knowledge, Die processing, Thinning, Downstream packaging interactions, Multi-team technical leadership, Technology transfer
Preferred skills
FOAK process development, Equipment and materials supplier collaboration, Mentoring and methodology development, Patents or publications, Solder reflow, TCB (Thermo-Compression Bonding)
Technologies
Solder reflow, TCB, Hybrid bonding
Responsibilities
Set technical direction for bonding processes, Develop and mature process flows and materials, Lead problem solving across wafer fab and packaging, Partner with integration and manufacturing teams, Drive technology transfer to manufacturing
Seniority
Senior, hands-on IC with technical leadership