VIE – MALTE - Ingénieur Support Recherche & Développement Boitier Micro-Electronique - F/H
Core
Support R&D development of microelectronic packages (BGA, SiP, FCBGA, LGA) for automotive, spatial, communication, and AI applications, bridging Grenoble R&D and production sites.
Role type
Junior IC packaging engineer (VIE trainee)
Builds
Microelectronic packages for automotive, spatial, communication, and AI applications
Domain
Semiconductor packaging and assembly
Required skills
Technical analysis, process development, documentation management, cross-functional collaboration, problem-solving, technical writing
Preferred skills
Knowledge of packaging technologies, understanding of industrialization processes, ability to work in a cleanroom environment
Technologies
BGA, SiP, FCBGA, FCCSP, LGA, Wire Bond
Responsibilities
Support Technical Package Leaders in project coordination, contribute to new assembly process development, analyze technical constraints and propose solutions, prepare and update project documentation, participate in solution validation and qualification, intervene regularly in cleanrooms and laboratories, support continuous improvement of manufacturing rules
Seniority
Junior, hands-on IC