NPI Die Attach Process Technician
Core
Supports development and validation of new process bricks for die attach processes to enable successful product release to mass production.
Role type
NPI Die Attach Process Technician
Builds
New semiconductor products (LGA, BGA, QFN, flip chip packages)
Domain
Semiconductor manufacturing / Die attach process
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Die attach process knowledge, equipment operation, root cause analysis, statistical analysis support, visual inspection
Preferred skills
Familiarity with pick-and-place systems, dispensing mechanisms, microscopic inspection
Technologies
ESEC 2100, ASM 8912, ASM838, Datacon, Stencil printing equipment
Responsibilities
Load materials, configure recipes, and run die attach machines; Execute process monitoring and troubleshooting; Ensure quality compliance and analyze defects; Support DOE activities and data gathering
Seniority
Junior to Mid-level, hands-on IC
