芯片贴装设备工程师/Die Attach Equipment Engineer
Core
Operate, maintain, and troubleshoot die attach equipment lines to ensure semiconductor packaging production efficiency and uptime.
Role type
Semiconductor equipment engineer (die attach)
Builds
Semiconductor packaging production lines
Domain
Semiconductor manufacturing / Die attach equipment
Deliverable
infrastructure
Required skills
Die attach equipment maintenance, preventive maintenance, spare parts management, equipment specification writing, installation and commissioning, mass production parameter calibration, equipment technical upgrades, line utilization rate control, emergency fault troubleshooting, failure analysis reporting, consumables and inventory control, OEM coordination for repairs and upgrades
Preferred skills
ASM and Besi die bonder structure and operation logic
Technologies
ASM, Besi
Responsibilities
Daily operation and maintenance of die attach production lines, fault repair, preventive maintenance, and spare parts management; Develop equipment purchase specifications, install and commission equipment, calibrate mass production parameters, upgrade equipment, and control line utilization rates; Handle sudden equipment downtime, output failure analysis reports, and reduce downtime losses; Compile equipment maintenance manuals and inspection standards; Manage equipment consumables and spare parts inventory; Coordinate with OEMs for equipment repair, version upgrades, and hardware modifications
Seniority
Mid-level, hands-on IC