Production Equipment Technician ( Discrete )
Core
Operate and monitor specialized semiconductor manufacturing equipment (die bond, wire bond, mold/trim, test handlers) to ensure stable production output and quality standards.
Role type
Production Equipment Technician (Discrete)
Builds
Semiconductor chips and components for automotive and industrial markets
Domain
Semiconductor manufacturing / Discrete electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Machine operation and monitoring, SOP adherence, machine setup and alignment, recipe loading, basic troubleshooting, preventive maintenance, data recording, 5S compliance, ESD handling
Preferred skills
Semiconductor process experience (die attach, wire bonding, mold-trim, final test), electrical/mechatronics background
Technologies
ASM (AD838, Twin 832P, SD890A, AD832D, Extreme family, Twin supreme, Eagle 60), Shinkawa/Yamaha (SPA 500, STC 500, ACB 3000, ACB 1000, UTC 5100, Connx Plus, Elite), Mold Fico/Besi I series, Hanmi, Ismeca, SRM, Tesex mapper
Responsibilities
Operate die bond/clip bonder, wire bonder, mold/trim, and test handler machines; perform machine setups, cleaning, and minor preventive maintenance; identify process abnormalities and report issues; record production data accurately; ensure safety and ESD compliance
Seniority
Entry to Mid-level, hands-on IC