Packaging Architect
Core
Own the development of advanced packaging solutions from concept through product release for extreme-scale AI and HPC data center workloads.
Role type
Senior IC Packaging Architect
Builds
Advanced 2D/3D packaging solutions for photonics engines and high-performance compute systems
Domain
Semiconductor packaging, photonics, AI data center infrastructure
Deliverable
production ML models | product features
Required skills
Advanced 2D/3D packaging technology expertise, optical packaging knowledge, power/signal integrity analysis, thermal-mechanical analysis, system-level trade-off analysis, high-speed interface expertise (SERDES, PCIe, D2D), EDA and CAD tool proficiency, substrate selection and interconnect architecture design
Preferred skills
Technical leadership of multi-disciplinary projects, independent decision-making in ambiguous environments, creative problem-solving under pressure
Technologies
SERDES, PCIe, die-to-die interconnects, EDA tools, CAD tools
Responsibilities
Evaluate and execute trade-offs across EIC/PIC layouts, die-to-die interfaces, and fiber attachment methods; Define and own packaging specifications for electrical, thermal, and mechanical performance; Determine optimal package architecture by analyzing constraints across silicon, package, and system levels; Partner with supply chain engineering to define technology and material requirements; Collaborate with Quality & Reliability teams on qualification criteria and issue resolution; Engage with product teams and customers to anticipate emerging architectures and influence roadmap direction; Monitor the competitive landscape in packaging technologies
Seniority
Senior, hands-on IC
