Mechanical Design Engineer
Core
Designing advanced mechanical packaging solutions for 3D-stacked photonics engines to enable high-performance AI and HPC data center architectures.
Role type
Senior IC mechanical design engineer (semiconductor packaging)
Builds
High-volume manufacturable photonics packages and optical assemblies for AI/HPC systems
Domain
Semiconductor packaging, optoelectronics, photonics, AI data center infrastructure
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Mechanical design, CAD (Solidworks/Creo), GD&T, tolerance stack-up analysis, FMEA, prototype management, semiconductor packaging knowledge (3D/2.5D/FCBGA)
Preferred skills
FEA (ANSYS/Abaqus), liquid cooling architectures, high-volume manufacturing/OSAT engagement, ASME Y14.5 standards
Technologies
Solidworks, Creo, ANSYS, Abaqus
Responsibilities
Create CAD models of package stack-up and components; Perform mechanical design analysis to improve integrity; Execute tolerance stack-up analyses and create GD&T drawings; Apply manufacturing expertise to influence design choices and evaluate cost implications; Collaborate with systems teams to ensure compliance with boundary conditions
Seniority
Mid-Senior, hands-on IC