Senior Packaging Integration Lead
Core
Senior individual-contributor technical leadership role owning end-to-end packaging solutions for advanced connectivity products, from architecture definition through production ramp.
Role type
Senior IC packaging integration lead
Builds
Advanced connectivity packages (2.5D/3D integration, chiplet/interposer, CoWoS-class, organic substrate) for rack-scale AI infrastructure
Domain
Semiconductor packaging and advanced connectivity
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging architecture definition, 2.5D/3D integration, TSV, chiplets, interposers, test vehicle strategy, SIPI analysis, thermal reliability, cross-functional stakeholder alignment, OSAT/foundry/substrate partner management, production ramp ownership
Preferred skills
UCIe/die-to-die interconnect, CoWoS-class platforms, silicon-bridge, advanced fan-out, co-packaged optics
Technologies
CXL, Ethernet, NVLink, PCIe, UALink, COSMOS, 2.5D/3D integration, TSV, chiplets, interposers, CoWoS, organic substrate
Responsibilities
Define package architecture and technology selection with feasibility and cost analysis; drive test vehicle strategy to de-risk new packaging technology; represent packaging across internal cross-functional teams and external supply base; translate customer requirements into package specifications; own package definition deliverables including POR/TOR and DFM alignment; drive risk identification and mitigation across the packaging roadmap.
Seniority
Senior, hands-on IC