Intern - Process Integration – Advanced Packaging
Core
Support the development of sophisticated interconnect technologies and advanced packaging solutions through experimental design, line monitoring, and data analysis.
Role type
Intern, Process Integration Engineer (Advanced Packaging)
Builds
Next-generation memory technologies and advanced interconnect/packaging solutions
Domain
Semiconductor manufacturing, Advanced Packaging
Required skills
Design of Experiments (DoE), Kepner-Tregoe (KT) problem-solving, JMP/system analytics, experimental design, statistical analysis, line monitoring, data analysis, AI tool usage
Preferred skills
Semiconductor process integration experience, structured problem-solving frameworks, statistical analysis tools, advanced packaging knowledge
Technologies
JMP, Micron systems, AI tools
Responsibilities
Lead problem-solving activities using structured methodologies, Define and implement Design of Experiments (DoE), Support line monitoring through project management, Develop new line monitoring methods, Conduct experimental work using Micron systems, Analyze experimental results and provide recommendations
Seniority
Intern