Process Integration Engineer, APTD
Core
Develop and integrate advanced semiconductor process flows for next-generation memory solutions (HBM, DRAM, NAND) to balance performance, yield, reliability, and manufacturability.
Role type
Senior IC Process Integration Engineer (Semiconductor)
Builds
Scalable manufacturing solutions for High Bandwidth Memory (HBM) and advanced memory technologies
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models
Required skills
Process integration, experiment design (DoE), statistical analysis (JMP), root-cause investigation, metrology/defect/parametric data analysis, manufacturing transfer, cross-functional collaboration
Preferred skills
Advanced packaging (wafer-level, fan-out, 2.5D/3D, TSV, bonding, chiplet), yield/reliability modeling, AI/ML tools for engineering workflows
Technologies
JMP, AI-enabled tools, statistical analysis tools
Responsibilities
Lead process integration projects for new technology development; Partner with device engineering, package design, and manufacturing teams to solve integration challenges; Design and analyze experiments to improve process performance and yield; Identify yield limiters and root causes using metrology and test data; Drive corrective actions from identification through validation; Develop integration flows balancing performance, cost, and schedule; Support technology qualification and manufacturing transfer across sites