Advanced Packaging Technology Development Engineer: Advance PKG stacking
Core
Develop and transfer next-generation semiconductor packaging technologies (flip chip, TCB, hybrid bonding) from development to high-volume production.
Role type
Senior IC packaging technology development engineer
Builds
New packaging processes and materials for memory and storage solutions
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
DOE planning and execution, data analysis, process troubleshooting, process transfer management, FDC/SPC review, equipment and material evaluation
Preferred skills
AI and data analytics application, automation tool usage
Technologies
Flip chip, TCB, hybrid bonding, FDC, SPC
Responsibilities
Explore new semiconductor packaging technologies; Set up and execute DOE plans; Build samples and perform data analysis; Lead process troubleshooting and efficiency improvements; Prepare documentation for process transfer from TD to HVM; Review process stability using FDC and SPC
Seniority
Senior, hands-on IC