Advanced Package Technology Development PI Staff Engineer
Core
Lead and manage Advanced Package Technology Development strategies to build high-performing, cost-effective packaging solutions with predictable reliability for memory and storage products.
Role type
Staff Engineer (Technology Development & Strategy)
Builds
Advanced packaging solutions (2.5D, 3DIC, FO, hybrid bond) for memory and storage products
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced package process development, 2.5D/3DIC/FO/hybrid bond architecture, AI tools (LLMs), data extraction/analysis/reporting, probe/parametric/backend/reliability testing, electronic materials properties, failure analysis, root cause troubleshooting, process flow interaction analysis
Preferred skills
Strategic technical decision making, cross-functional leadership, mentoring, self-direction
Technologies
JMP, Large Language Models, Claude code
Responsibilities
Develop and communicate technology development strategic objectives aligned with company strategy; Set long-term technical objectives; Represent Assembly team in cross-functional leadership; Apply knowledge to achieve quality improvements, cost control, and production efficiency; Mentor and develop leaders; Troubleshoot problems and address root causes
Seniority
Staff, strategic leadership & hands-on technical expertise