Advanced Package Technology Development Engineer - Staff Engineer
Core
Lead and manage Advanced Package Technology Development strategies to build high-performing, cost-effective packaging solutions with predictable reliability for memory and storage products.
Role type
Staff Engineer (Technical Leadership & Strategy)
Builds
Advanced packaging solutions (2.5D, 3DIC, FO, hybrid bond) for memory and storage devices
Domain
Semiconductor Manufacturing / Advanced Packaging
Required skills
Advanced package process development (WSS, dicing, stacking, molding, inspection), Advanced package architecture (2.5D, 3DIC, FO, hybrid bond), Data analysis and reporting (JMP, system data mining), Reliability testing (probe, parametric, backend), Electronic materials and failure analysis, Root cause troubleshooting, Strategic planning and execution, Cross-functional leadership, Resource optimization
Preferred skills
AI tool integration, Continuous improvement methodologies, Self-direction with minimal supervision
Technologies
JMP, WSS, 2.5D, 3DIC, FO, Hybrid Bond
Responsibilities
Develop and communicate technology development strategies and objectives, Provide technical leadership to influence company direction, Represent assembly team in cross-functional initiatives, Ensure quality improvements, cost control, and production efficiency, Mentor and develop functional leaders, Apply knowledge to achieve organization objectives
Seniority
Staff, Strategic Leadership & Mentorship
