Senior Materials Engineer / Scientist
Core
Define and enable the materials foundation for next-generation memory and advanced packaging technologies (HBM, 3D memory, heterogeneous integration) by developing, characterizing, qualifying, and integrating new materials.
Role type
Senior IC materials engineer/scientist (semiconductor packaging)
Builds
Next-gen memory and advanced packaging products (HBM, 3D memory)
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Materials science fundamentals, experimental design, data analysis, hypothesis testing, cross-functional collaboration, technical communication, independent problem solving
Preferred skills
PhD in relevant discipline, end-to-end material implementation experience, patent/publication history, external partner management, semiconductor/microelectronics background, polymer encapsulation expertise, AI-enabled modeling experience
Technologies
Polymer composites, encapsulation materials (NCF, MUF, mold compounds, underfills, die-attach), temporary bonding/release materials, carrier systems, back-grind/dicing tapes, dielectrics, films, coatings, thermal materials, substrate/RDL materials, modeling/simulation tools, AI tools