Packaging Area Shift Engineer, Advanced Packaging Technology Development
Core
Shift-based execution support for Die Level Technology (DLT) development activities in advanced packaging manufacturing, ensuring safe and efficient lot movement and process stability.
Role type
Shift Engineer (Advanced Packaging Manufacturing Development)
Builds
Advanced packaging development lots and HBM technology processes
Domain
Semiconductor manufacturing / Advanced Packaging / Memory & Storage
Required skills
Semiconductor manufacturing process knowledge, structured problem solving, data analysis, Statistical Process Control (SPC), shift handoff management, equipment abnormality response
Preferred skills
DLT process engineering experience, advanced packaging background, HBM development execution, cross-functional development environment experience (via careerplan.io/jobs/44708828-packaging-area-shift-engineer-advanced-packaging-technology-development-at-micron)
Technologies
Microsoft Excel, PowerPoint, Word, SPC tools, digital data analysis tools
Responsibilities
Execute development lot activities and monitor process levels across rotating day/night shifts; investigate and respond to process issues and equipment abnormalities; collect and analyze data for issue containment and continuous improvement; support process setup, qualification, and new equipment/material evaluations; provide clear shift handoffs and escalate barriers to cross-functional teams.
Seniority
Entry to Mid-level, hands-on IC