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[Fab15 HVM] - Dry Etch Process Equipment Engineer

Hiroshima, Japan💼 Full-time🗓 2026-03-17 → 2026-09-26

Core

Drive yield improvement, productivity enhancement, and production technology management for advanced DRAM semiconductor manufacturing via dry etch processes.

Role type

Senior IC process equipment engineer (semiconductor manufacturing)

Builds

High-volume production of advanced DRAM memory chips

Domain

Semiconductor manufacturing / Memory and storage

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Problem-solving, project coordination, cross-functional collaboration, technical reporting, process optimization, equipment troubleshooting, shift management coordination, new equipment integration support, standardization across global sites, data analysis

Preferred skills

Background in physics, chemistry, mechanical, or electrical engineering

Technologies

Dry etch equipment, Microsoft Office (Excel, PowerPoint, Word)

Responsibilities

Improve yield rates and management systems, enhance productivity, support introduction and modification of new advanced equipment, identify and resolve production issues during product introduction, lead improvement activities with equipment and process engineers and technicians, report daily issues and long-term projects to supervisors and stakeholders, participate in technical exchanges with overseas Micron production sites

Seniority

Mid-level to Senior, hands-on IC

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