3DIC Yield Analytics & Diagnostics Engineer, Staff
Core
Drive yield learning and diagnostics for next-generation 2.5D, 3DIC, chiplet, and heterogeneous integration technologies across wafer, package, assembly, and multi-die stack environments.
Role type
Staff 3DIC Yield Analytics & Diagnostics Engineer
Builds
Scalable yield analytics frameworks, diagnostic methodologies, and yield-monitoring dashboards for Qualcomm's advanced 3DIC and heterogeneous integration products.
Domain
Semiconductor manufacturing, advanced packaging, and heterogeneous integration
Deliverable
production ML models
Required skills
Statistical modeling, machine learning, AI techniques, semiconductor yield analytics, diagnostics, failure analysis, large-scale data analysis, root-cause analysis (RCA), Python, SQL, JMP, Power BI
Preferred skills
2.5D/3DIC architectures, chiplet integration, TSV/interposer technologies, hybrid bonding, DRAM/HBM diagnostics, defect characterization, failure-mechanism modeling
Technologies
Python, JMP, SQL, Yield Explorer, Power BI
Responsibilities
Lead 3DIC yield analytics initiatives to drive systematic yield improvement; Analyze large-scale yield and diagnostics datasets to identify failure mechanisms; Develop and scale methodologies for analyzing heterogeneous data sources; Perform advanced diagnostics to isolate failure mechanisms across chiplets, logic die, stacked DRAM, TSVs, interposers, micro-bumps, and hybrid bonding interfaces; Drive structured root-cause analysis and validate failure mechanisms; Analyze memory diagnostics data including SRAM and stacked-DRAM bitmap analysis; Apply statistical modeling, machine learning, and AI techniques to accelerate diagnostics and predictive yield learning.
Seniority
Staff, technical leadership & cross-functional influence
