Staff Process Engineer, Advanced Packaging CMP
Core
Develop and optimize Chemical Mechanical Planarization (CMP) processes for advanced packaging to improve product quality, yield, and reliability for next-generation semiconductor products. (via careerplan.io/jobs/44634706-staff-process-engineer-advanced-packaging-cmp-at-micron)
Role type
Staff Process Engineer (Advanced Packaging CMP)
Builds
Next-generation memory and storage interconnects and packaging solutions
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Chemical Mechanical Planarization (CMP) process development, failure analysis (FMEA, 8D, SPC/FDC), equipment operation (AMAT, EBARA), dielectric/metal CMP, manufacturing methods integration, process monitoring and control, technical advisory, project leadership, AI application in workflows
Preferred skills
PhD in relevant engineering/science fields, data science and modeling, AI for workflow optimization, 300mm wafer fabrication background
Technologies
AMAT (LKP), EBARA-300X, optical metrology, profilometry, polishing slurries, conditioners, polishing pads