Sr. Manager, Assembly Process Development (APTD)
Core
Develop and execute technology development strategy for advanced packaging processes to improve quality, cost control, and production efficiency.
Role type
Senior Manager, Assembly Process Development
Builds
Advanced packaging solutions (2.5D, 3DIC, FO, hybrid bond) for memory and storage products
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced packaging process expertise, 2.5D/3DIC/FO/hybrid bond knowledge, process flow analysis, yield/performance/reliability optimization, electronic materials characterization, root cause troubleshooting, data analysis and reporting, team leadership, cross-functional collaboration
Preferred skills
AI-enabled workflow adoption, automation and digital solutions implementation, advanced analytics for operational effectiveness
Technologies
JMP, system data mining tools, probe testing, parametric testing, backend testing, reliability testing equipment