DMTS Process Development Engineer, Advanced Packaging
Core
Lead strategic process development for Micron's advanced memory products (HBM, 3DS DRAM) and emerging 3D architectures, driving end-to-end technology execution from pathfinding to manufacturing readiness.
Role type
Senior IC process development engineer (advanced packaging)
Builds
Production-ready advanced packaging solutions for memory and storage
Domain
Semiconductor manufacturing / Advanced Packaging (via careerplan.io/jobs/44590097-dmts-process-development-engineer-advanced-packaging-at-micron)
Required skills
Semiconductor process development, Advanced packaging (wafer-level/die-level), Process integration, Materials science, Cross-functional program leadership, Strategic decision-making, AI/advanced analytics application, FOAK development, Supplier engagement, Technology transfer
Preferred skills
PhD in relevant field, Advanced memory technologies expertise, 3D packaging architectures, Technical mentoring, Materials characterization and simulation
Technologies
CMP, Etch, Cleans, Thin films, Lithography, Hybrid bonding, TCB, Dicing, Molding, AI-enabled tools, Automation, Data analytics, Advanced modeling