3D Integration & Advanced Packaging Expert
Core
Build and maintain ASML expertise in Advanced Packaging and 3D Integration technologies to accelerate product readiness and support customer tool usability and automation challenges.
Role type
Senior IC process integration engineer (advanced packaging & 3D integration)
Builds
ASML 3D products and advanced packaging solutions
Domain
Semiconductor manufacturing / Advanced Packaging / 3D IC / Hybrid Bonding
Required skills
Advanced Packaging process integration, 3D IC technologies, Hybrid Bonding, semiconductor manufacturing process flows, customer requirement translation, product roadmap planning, validation plan leadership
Preferred skills
Business Administration or commercial education, network with customers and partners (via careerplan.io/jobs/J-00352450-3d-integration-advanced-packaging-expert-at-asml)
Technologies
ASML tools, 3D Integration equipment, Hybrid Bonding systems
Responsibilities
Define customer-driven technical requirements and performance targets, lead customer validation plans, support product strategy and roadmap planning, review system design against customer requirements, share knowledge on advanced packaging processes
Seniority
Senior, hands-on IC
