Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)
Core
Lead a team to develop and integrate advanced 2.5D/3D packaging technologies (HBM, hybrid bonding) from concept to full-scale manufacturing for next-gen AI and HPC products.
Role type
Senior IC Process Integration Lead (Advanced Packaging)
Builds
Next-generation multi-die solutions, 2.5D/3D packaging platforms, HBM implementations
Domain
Semiconductor manufacturing / Advanced Packaging / AI Hardware
Deliverable
production ML models
Required skills
Advanced packaging technology development, 2.5D/3D stacking, HBM integration, hybrid bonding (W2W/C2W), warpage engineering, DOE, defect analysis, SPC, technology transfer, team leadership
Preferred skills
PhD or Master's degree, scaling technologies from R&D to manufacturing, yield analysis, statistical process control, warpage modeling, technical publications/patents
Technologies
TSV, underfill, molding, bonding, AI-enabled engineering workflows
Responsibilities
Manage team for process integration across 2.5D/3D platforms; Spearhead development and qualification of emerging packaging technologies; Improve yield and reliability via defect analysis and data-driven investigation; Lead technology transfer to manufacturing; Partner with cross-functional teams to scale methodologies; Engineer warpage mitigation via modeling and material controls.
