Director, Technical Package Development
Core
Lead strategy, development, and execution of advanced memory packaging solutions for Micron's next-generation products.
Role type
Director, Technical Package Development (DRAM Packaging)
Builds
Advanced packaging technologies (HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets) for AI, cloud, mobile, automotive, HPC, and data center markets.
Domain
Semiconductor / Memory and Storage
Required skills
Advanced packaging technologies (HBM, LPDRAM, DDR, 3D stacking, heterogeneous integration), technology roadmap definition, global engineering organization leadership, business-critical technology decision making, multi-functional collaboration, cost analysis, risk assessment.
Preferred skills
AI/ML implementation for engineering productivity, digital transformation, automation, data science, executive communication, patent generation, future technology roadmap influence, team mentoring.
Technologies
HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, interconnect solutions, AI, machine learning, advanced analytics, digital engineering.
Responsibilities
Define and execute long-term DRAM packaging strategies; Lead development and deployment of advanced packaging technologies; Drive adoption of AI and digital engineering approaches; Build and lead a global packaging organization; Partner with design, manufacturing, and supply chain teams; Establish strategic relationships with customers and partners; Lead technology investment decisions.
Seniority
Director, executive leadership
