Engineer, PDE CEM
Core
Own and optimize semiconductor packaging assembly processes, integrating AI and data-driven methodologies to enhance yield, quality, and reliability in high-volume manufacturing.
Role type
Senior IC Process Development Engineer (Backend Assembly)
Builds
High-performance memory and storage packaging solutions
Domain
Semiconductor manufacturing / Backend assembly
Deliverable
production ML models
Required skills
Semiconductor process development, Backend assembly, DOE, SPC, Six Sigma, Statistical analysis, AI/ML fundamentals, Python, SQL, RCA, FMEA, JMP
Preferred skills
Industry 4.0 concepts, Predictive process control, Cross-functional leadership
Technologies
MES, JMP, Python, SQL
Responsibilities
Define process specifications and capabilities (CPK), Drive NPI qualification, Apply DOE and SPC for optimization, Lead root cause analysis and yield improvement, Leverage AI/ML for predictive control and anomaly detection, Evaluate new materials and technologies
Seniority
Senior, hands-on IC