Staff Engineer, Advanced Packaging Technology Development
Core
Lead the development of world-class semiconductor packaging technologies, including 2.5D/3D integration and hybrid bonding, to drive innovation and strategic goals for Micron.
Role type
Staff Engineer, Advanced Packaging Technology Development
Builds
High-bandwidth memory (HBM), 2.5D/3D integrated memory and storage solutions
Domain
Semiconductor manufacturing, Advanced Packaging, Memory/Storage
Required skills
Advanced packaging engineering, 2.5D/3D integration, Hybrid bonding, Wafer Level Packaging, 3D stacking, DRAM manufacturing, OSAT operations, Technical roadmap creation, Competitive analysis, AI-enabled engineering tools, Data analytics, Process module engineering
Preferred skills
DRAM wafer structure knowledge, East Asian languages, Patent inventions, Published literature
Technologies
AI-assisted tools, Data analytics platforms, Digital technologies
Responsibilities
Direct the creation of packaging technology roadmaps, Lead multi-disciplinary technical teams, Collaborate with internal and external partners, Analyze competitive metrics through data intelligence, Troubleshoot sophisticated issues, Innovate through patents and technical presentations, Drive cost reduction and quality improvement initiatives
Seniority
Staff, hands-on IC with strategic influence