Senior Engineer, HIG HBM Package PE
Core
Lead and develop a high-performing team to drive Package PE activities for Next Generation HBM products, focusing on Quality, Cost, Cycle Time, and Scale.
Role type
Senior IC Product Engineering Manager (HBM Packaging)
Builds
High-performance HBM memory and storage products
Domain
Semiconductor manufacturing / Memory and Storage
Deliverable
production ML models
Required skills
Semiconductor industry experience, Product Engineering, Packaging, Team Leadership, Yield Improvement, Data Analysis, Statistical tools, Machine Learning/AI, Cross-functional collaboration, Process Conversion
Preferred skills
Micron experience, Electrical Engineering degree
Technologies
Statistical tools, Machine Learning, AI, Agentic AI
Responsibilities
Improve assembly coverage to reduce inline fallout and field DPM; Drive down HBM Cube on Wafer Assembly Yield Loss; Own cumulative yield with cross-functional teams; Manage Qual/Package Qual and RMA Packaging issues; Establish robust Process Conversion Business Processes; Utilize statistical tools/ML/AI for yield and reliability data analysis; Create deviation alert systems for yield loss and trends; Mentor and develop team members; Collaborate with Fab, TD, APTD, PDE, Design, and System teams; Promote innovation and deploy AI tools for operational efficiency.
Seniority
Senior, hands-on IC with leadership responsibilities