HBM Advanced Package Process / Equipment Engineer
Core
Accountable for Bond process, backup for Debond area maintenance, establish/improve process conditions, upgrade tool capability, set up parameters for semiconductor equipment, and leverage AI/data analytics for process monitoring and optimization.
Role type
Semiconductor process engineer (HBM Advanced Package)
Builds
High-bandwidth memory (HBM) packages and semiconductor manufacturing equipment
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models
Required skills
Bond process expertise, Debond area maintenance, process parameter setup, abnormal analysis, AI and data analytics tools, equipment evaluation
Preferred skills
3+ years production line experience, process maintain experience
Technologies
AI tools, data analytics tools
Responsibilities
Account for Bond process, Backup for Debond area process basic maintenance, Establish and improve process condition and technology, Upgrade tool capability and improve product quality, Set up process parameters for semiconductor equipment, Abnormal analysis and improvement