Advanced Packaging Technology Development (APTD) Process Technical Specialist
Core
Support new technology implementation and process improvement for high-performance memory products (HBM) in advanced packaging.
Role type
Process Technical Specialist (IC)
Builds
High bandwidth memory (HBM) and advanced packaging solutions for AI and supercomputing
Domain
Semiconductor manufacturing / Memory technology
Required skills
Data analysis, SPC chart interpretation, Process characterization, Metrology support, Project management, Documentation, Multitasking, Independent work
Preferred skills
Semiconductor experience, Python/SQL scripting, Tableau, Electrical/Materials Engineering degree
Technologies
Yield 3, JMP, Micron Central, MAM, SPACE, GCP, SPC, SWR, FDC, LMS, GerM
Responsibilities
Execute SWR logistics and monitor product line disposition, Assist in inline inspection and coordinate non-routine metro/RDA inspections, Support new DID and process system setup, Monitor key parametric indices and trigger investigations, Manage Team Level KPIs (GCP, SWR, WIP), Improve process capability and yield
Seniority
Individual Contributor (IC), entry to mid-level