Advanced Packaging Intern, MS - Summer 2027
Core
Perform signal integrity (SI), power integrity (PI), and electromagnetic (EM) simulations for advanced packaging and high-speed interconnects to ensure electrical performance requirements are met.
Role type
Intern, electrical simulation engineer (advanced packaging)
Builds
High-speed signaling and power delivery solutions for multi-chip and multiple component configurations
Domain
Semiconductor / Advanced Packaging / High-Speed Interconnects
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Signal integrity (SI) analysis, Power integrity (PI) analysis, Electromagnetic (EM) fundamentals, Circuit simulation techniques, PCB/package design evaluation, Frequency-domain and time-domain analysis, Technical documentation
Preferred skills
2-D/3-D electromagnetic simulation tools (Ansys HFSS, SIwave, Cadence Clarity), Advanced packaging technologies (2.5D/3D), IC package design tools (Cadence APD), Python/MATLAB scripting
Technologies
Ansys HFSS, SIwave, Cadence Clarity, Cadence APD, Python, MATLAB
Responsibilities
Perform SI/PI/EM simulations for advanced packaging, Evaluate package and PCB designs, Analyze power distribution networks (PDNs) and high-speed channels, Execute simulation and verification activities, Develop scripts and automation tools, Document results and present technical findings
Seniority
Intern
