Package Reliability Engineer
Core
Conduct physics of failure (PoF)-based reliability modeling, stress testing, and failure analysis for 2.5D/3D advanced semiconductor packages to ensure manufacturability and robustness.
Role type
Senior IC Package Reliability Engineer (Advanced Packaging)
Builds
2.5D/3D advanced semiconductor packages for data infrastructure, enterprise, cloud, and AI applications
Domain
Semiconductor manufacturing / Advanced Packaging / Materials Science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Physics of failure (PoF) methodologies, materials science (substrates, dielectrics, adhesives), stress modeling (ANSYS, Abaqus, COMSOL), failure analysis techniques (C-SAM, X-ray CT, SEM, TEM, FIB, EBSD), OSAT collaboration, JEDEC/IPC/IEEE standards
Preferred skills
Heterogeneous integration, fan-out packaging, chiplet architectures, electrical reliability mechanisms (electromigration, TDB), AI-driven reliability modeling
Technologies
ANSYS, Abaqus, COMSOL, C-SAM, X-ray CT, SEM, TEM, FIB, EBSD
Responsibilities
Conduct PoF-based reliability modeling and stress test plans (thermal cycling, humidity, electromigration); collaborate with OSATs to drive reliability improvements and yield enhancements; evaluate and select materials for optimal reliability; lead failure mode analysis (FMEA) and root cause identification using advanced microscopy; work cross-functionally to define assembly test vehicles and optimize package architectures
Seniority
Senior, hands-on IC
