Field Application Engineer Intern (Hardware)
Core
Intern supporting customer engagements, debugging hardware/software systems, and optimizing optical interconnect product performance.
Role type
Field Application Engineer Intern (Hardware)
Builds
Optical interconnect products (PAM4 DSP, Coherent DSP, TIA, driver)
Domain
Semiconductor / Optical Communications / High-Speed SerDes
Deliverable
client delivery
Required skills
PAM4 DSP, analog TIA, driver chip designs, optical communication systems, SI/PI simulations, hardware/software co-debugging
Preferred skills
AMS high-speed SerDes research, 5nm/3nm/2nm process nodes knowledge
Technologies
PAM4, Coherent ODSP, 112G/224G/448G applications, SerDes DSPs
Responsibilities
Review customer schematic and layout designs, support lab activities to tune and optimize customer product, participate in product bring-up and evaluation, join customer support to assist in debugging issues, contribute to technical documentation
Seniority
Intern