Principal Package Engineer
Core
Manage image sensor packaging technology development, process improvement, and new product introduction for CSP, BGA, and LGA packages used in automotive, industrial, and consumer sensing systems.
Role type
Principal Package Engineer (Semiconductor Assembly & Packaging)
Builds
Advanced packaging solutions for image sensors and sensing systems
Domain
Semiconductor manufacturing, Automotive, Industrial, Consumer electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor assembly packaging development, process engineering, materials development, new product introduction, wafer level CSP assembly, TSV processes, die attach, wire bonding, molding, statistical analysis (DOE), package reliability analysis, project management, problem-solving
Preferred skills
Imager packaging experience, sensor packaging experience, AI tools proficiency (ChatGPT, Microsoft Copilot)
Technologies
CSP, BGA, LGA, TSV, DOE, ChatGPT, Microsoft Copilot
Responsibilities
Manage image sensor packaging technology development, develop analytical techniques for evaluating new package designs, interact with business units and external suppliers, support corporate product and technology development
Seniority
Principal, hands-on IC with strategic oversight
