TECHNICIAN 4, MANUFACTURING
Core
Operate and monitor die bond/clip bonder machines to ensure stable production output in semiconductor manufacturing.
Role type
Manufacturing Technician (Semiconductor Die Attach)
Builds
Semiconductor chips and components
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Machine operation, machine setup, preventive maintenance, data recording, ESD handling, 5S compliance, basic troubleshooting
Preferred skills
Semiconductor process experience, shift work adaptability
Technologies
ASM (AD838, AD8312Plus, Alphsam), CB830, REFLOW, ASM DEK, VADU, CREST
Responsibilities
Operate die bond/clip bonder machines, perform die/clip attach processes, conduct machine setup and alignment, perform regular machine checks and cleaning, identify process abnormalities and report issues, assist in troubleshooting equipment issues, record production data accurately
Seniority
Entry to Mid-level, hands-on IC