TECHNICIAN 2, MANUFACTURING
Core
Operate and monitor wire bonder machines to ensure stable production output in semiconductor manufacturing.
Role type
Manufacturing Technician (Wire Bonding)
Builds
Semiconductor components via wire bonding processes
Domain
Semiconductor manufacturing / Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Machine operation, SOP adherence, machine setup, alignment, recipe loading, parameter adjustment, preventive maintenance, data recording, 5S compliance, ESD handling, basic troubleshooting
Preferred skills
Semiconductor die attach/dieClip bonding experience, shift work adaptability
Technologies
ASM (Extreme family, Gocu, Eagle 60AP), Kns (Connx Plus)
Responsibilities
Operate and monitor wire bonder machines; Perform wire bond processes according to SOP; Conduct machine setup, alignment, and recipe loading; Perform regular machine checks, cleaning, and minor preventive maintenance; Identify process abnormalities and report issues; Record production data accurately; Ensure workplace 5S, safety compliance, and proper ESD handling
Seniority
Entry to Mid-level, hands-on IC