DEMQRA DQA WLR Technician
Core
Operate automated die bonders and wire bonding equipment to assemble semiconductor devices, perform reliability stress tests, and ensure quality control in a precision manufacturing environment.
Role type
Semiconductor assembly and test technician
Builds
Memory and storage solutions (die-bonded and wire-bonded devices)
Domain
Semiconductor manufacturing / Precision electronics
Required skills
Automated die bonder operation, wire bonding (ball/wedge), electromigration and reliability stress testing, equipment troubleshooting, preventive maintenance, calibration, cleanroom gowning, fine motor precision, data collection and reporting
Preferred skills
Experience with automated assembly equipment setup and recipe editing, vision/alignment systems, high-temperature oven operation, parametric data collection
Technologies
Automated die bonders, wire bonding tools, electromigration test systems, Ariba, Copilot/AI tools
Responsibilities
Perform die attach using automated die bonders; wire bond assembled devices and verify bond quality; set up and run electromigration and reliability stress tests; collect and report test data; perform equipment troubleshooting, preventive maintenance, and calibration; schedule PMs and service calls; purchase parts and services; support smart-manufacturing initiatives and AI tool implementation; follow and improve work instructions and safety procedures; partner with engineering on sample builds and failure analysis
Seniority
Entry-level to Mid-level, hands-on IC