TECHNICIAN, MANUFACTURING EQUIPMENT
Core
Operate and monitor semiconductor manufacturing equipment for die/clip bonding, wire bonding, and final testing to ensure stable production output and quality standards.
Role type
Manufacturing Equipment Technician (Semiconductor)
Builds
Semiconductor power and sensing components for automotive and industrial markets
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Equipment operation, machine setup, minor preventive maintenance, basic troubleshooting, data recording, ESD handling, 5S compliance
Preferred skills
Semiconductor process experience (die attach, wire bonding, mold-trim, final test), turret-based handler knowledge, multisite discrete/analog testing, automatic vision inspection
Technologies
ASM (AD838, Twin 832P, SD890A, AD832D), Shinkawa, Yamaha (SPA 500, STC 500)
Responsibilities
Operate die bond/clip bonder and final test machines; perform machine setup, alignment, and recipe loading; conduct routine checks, cleaning, and minor maintenance; isolate and segregate test rejects; record production data accurately; assist in troubleshooting and process improvements
Seniority
Mid-level, hands-on IC